A system for the application of polycrystalline and amorphous layers by the sputtering method. It has the possibility of deposition directly from targets (possibility of applying multi-component targets) and the so-called reactive sputtering of gases in reactive atmospheric layers of conductive and non-conductive materials. There is also the possibility of re-cleaning substrates before the layer application process. The size of used substrates is in the range from 5 x 5 mm to 100 x 100 mm and thickness from 0.05 mm to 50 mm.
133 Wólczyńska St.