A system for the application of polycrystalline and amorphous layers by the sputtering method. It has the possibility of deposition directly from targets (possibility of applying multi-component targets) and the so-called reactive sputtering of gases in reactive atmospheric layers of conductive and non-conductive materials. There is also the possibility of re-cleaning substrates before the layer application process. The size of used substrates is in the range from 5 x 5 mm to 100 x 100 mm and thickness from 0.05 mm to 50 mm.


27 August 2022

Sputtering SYSTEM ULVAC SBR-230 6E (Ł-ITME)

  1. pl
  2. en

01-919  Warsaw
133 Wólczyńska St. 


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