Nanoengineering is an essential bridge that utilizes nanoscience and nanotechnology to enable a broad spectrum of totally new materials, functionalities, applications, devices, and products. Conventional photonic manufacturing technologies have extended well into the nanometer regime. Over-extended technologies are pushing sizes and densities into ranges that challenge reliability and basic physics. Nanoengineering also allows for manipulating matter at the nanoscale. Newly engineered materials, processes, ultrahigh precision and metrologies are emerging. Novel synthesized nanomaterials, based on 1D, 2D, and 3D architectures, nanocomposites and hierarchical assemblies based on such materials offer exciting opportunities. Nanostructured thin films display unique phenomena, thus enabling the improvement of traditional applications or the development of novel applications. Newly attainable design and fabrication of miniature optical elements have enabled the development of micro/nano/quantum-scale optical, near field optics, and optoelectronic elements in ever more diverse application areas. New low power logic and memory devices, expanded functionality, systems on a chip, solar cells, energy storage devices, biotechnology, photonics, photovoltaics, molecular electronics and optics are emerging. Application areas are highly diversified and include telecommunications, data communications, consumer electronics, microwave photonics, optical computing, neural networks, optical storage, non-volatile data storage, information display, optical imaging, printing, optical sensing, optical scanning, renewable energy harvest and storage, medical diagnosis, chemical/ biological/environmental sensing, new nanomechanic applications, and new medical devices and prosthetic methods.
Critical to this realization of robust nanomanufacturing is the development of appropriate instrumentation, metrology, and standards. As novel applications emerge, the demand for highly sensitive and efficient measurement tools with the capability of rapid, automated, and thorough coverage of large functional areas at high precision is emerging.
The newly upcoming nanotechnologies present new opportunities and challenges in materials processing, device design, and integration. Drivers for commercial deployment include increased functionality, small form factor, performance, reliability, cost, as well as renewable energy and climate change mitigation.
Papers areas Chairs and Committees
Abstract Due: 9 February 2022Author Notification: 18 April 2022Manuscript Due: 27 July 2022
LIGHT-MATTER INTERACTIONS IN 1D AND 2D NANOMATERIALS
NANOSTRUCTURED THIN FILMS
HIGH PRECISION NANOPOSITIONING AND FEEDBACK, NEW METROLOGIES FOR PHOTONICS
DEVICES AND PROPERTIES OF NANOSTRUCTURES FOR PHOTONICS (EXPERIMENT AND/OR THEORY)
ENERGY HARVESTING AND STORAGE NANOTECHNOLOGIES
INNOVATIVE PATTERNING, MATERIALS ENGINEERING, NANOFABRICATION, AND NANOLITHOGRAPHY FOR PHOTONICS APPLICATIONS
NANOMANUFACTURING OF 1D AND 2D NANOMATERIALS FOR PHOTONICS APPLICATIONS
NANO- AND MICRO-OPTICS
COMMERCIALIZATION OF NANO- AND MICRO-STRUCTURE PHOTONIC AND OTHER DEVICES, MODULES, AND SYSTEMS
Balaji Panchapakesan Worcester Polytechnic Institute (United States) Conference Chair André-Jean Attias Sorbonne Univ. (France), Yonsei Univ. (Korea, Republic of) Conference Chair Wounjhang Park Univ. of Colorado Boulder (United States) Program Committee Bharat Bhushan The Ohio State Univ. (United States) Program Committee Stephane Bruynooghe Carl Zeiss Jena GmbH (Germany) Program Committee Francesco Chiadini Univ. degli Studi di Salerno (Italy) Program Committee Pankaj Kumar Choudhury Univ. Kebangsaan Malaysia (Malaysia) Program Committee Luca Dal Negro Boston Univ. (United States) Program Committee Elizabeth A. Dobisz Spin Transfer Technologies, Inc. (United States) Program Committee Frédéric Guittard Univ. de Nice Sophia Antipolis (France)Program Committee Ghassan E. Jabbour Arizona State Univ. (United States) Program Committee Yi-Jun Jen National Taipei Univ. of Technology (Taiwan) Program Committee Anders Kristensen DTU Nanotech (Denmark) Program Committee Akhlesh Lakhtakia The Pennsylvania State Univ. (United States) Program Committee Tom G. Mackay The Univ. of Edinburgh (United Kingdom) Program Committee H. Angus Macleod Thin Film Center, Inc. (United States)
Robert Magnusson The Univ. of Texas at Arlington (United States) Program Committee Dorota A. Pawlak Institute of Electronic Materials Technology (Poland) Program Committee Michael T. Postek Univ. of South Florida (United States) Program Committee Dianne L. Poster National Institute of Standards and Technology (United States) Program Committee Anne E. Sakdinawat SLAC National Accelerator Lab. (United States) Program Committee Geoffrey B. SmithUniv. of Technology, Sydney (Australia) Program Committee Motofumi Suzuki Kyoto Univ. (Japan)Program Committee Tomas Tolenis Ctr. for Physical Sciences and Technology (Lithuania) Program Committee Chee Wei Wong Univ. of California, Los Angeles (United States) Program Committee Anatoly V. Zayats King's College London (United Kingdom)
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